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hermetically sealed container
Hermetic Packages manufacturer
hermetic packages electronics

PRODUCTS

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We specialize in the development and manufacturing of diverse metal packaging and electronic components.
Opto-Electronic Packages
Opto-Electronic Packages
At Jitai, we aim to uphold structural integrity in demanding conditions while minimizing optical insertion loss in opto-electronic packages. Our range includes various shapes and sizes, each featuring multiple opto-channel design choices. We employ a range of forming and fabrication techniques tailored to specific production requirements.
 

Technical Parameters:

Hermeticity

≤  1 x 10-3  Pa * cm3 /s

Insulation Resistance

 ≥1× 1010 Ω (500V DC) glass

 ≥1× 109 Ω (500V DC) ceramic

Salt Spray Test

24h

Flatness

≤ 0.05mm

Roughness

0.8μm

Plating Quality Test

N2 450±10°C, 15 min

Temperature Cycling

-55°C to 125°C, 20 cycles

Thermal Shock

-55°C to 125°C, 20 cycles

Mechanical Shock

Condition B, Y1 Direction, 10,000g
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Power Packages
Power Packages

Applications：All kins of high power thick and thin film hybrid circuits.

Materials used: 10# steel, oxygen-free copper, tungsten-copper, etc., all of which have great heat dissipation performance.

Technial parameters

Sealing Method

Parallel Seam Welding. Laser Welding

Housing materials

10# steel, tungsten copper, molybdenum copper, oxygen-free copper, etc.

Lead materials

4J50 copper core, 4J29 copper core, 4J50, oxygen-free copper, zirconium copper, etc.

Insulation resistance

500VDC, insulation resistance between single lead and housing ≥1×1010 Ω
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Microwave Packages
Microwave Packages

Applications： Phased array radar systems, millimeter wave imaging, satellite communications, remote sensing and other fields.

Technial parameters

Materials

Kovar, tungsent-copper, copper oxide, etc

Frequency

0-50GHz

VSWR

<1.2

Impedance ratio

50Ω

Insulation resistance

500V DC, insulation resistance between single lead and housing ≥1×1010 Ω

Hemeticity

Air leakage rate≤1×10-3Pa∙m3/s
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HIC Packages
HIC Packages

Applications：All kinds of monolithic integrated circuits and hybrid integrated circuit packaging.
Materials used: Kovar, 42 alloy, #10 steel

HIC Packages

Structures

Machined/Stamped/Welded

Design

Platform/Sidewall

Materials

Kovar/Alloy42/CRS

Leads

Cylindrical/Straight/Bent

Lead Layouts

DIP/Quad Inline

Insulator

BH Series/Elan #13/DM-305

Lid Sealing Design

Percussion Welding/Tin Welding/Laser Welding

Plating

Ni,Au/Ni

Insulation Resistance

500V DC resistance between single glass sealed pin and base is ≥1×10^10 Ω

Hermeticity

Leak rate is ≤1×10^-3 Pa·cm 3/s
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Sensor Packages
Sensor Packages
●Hermeticity: Must adhere to an airtightness requirement of ≤1×10-3Pa·cm3/s, as confirmed during fluctuating high-pressure testing.
●Insulation: Lead-to-housing insulation resistance must be ≥1×109Ω.
●Bonding: Inner wire bonding.
●Solderability: Shell surface should exhibit properties conducive to easy solderability.



 
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TO Packages
TO Packages
Transistor Outline (TO) packages consist of two parts: the TO header and the TO cap. We offer various standard TO connector shapes and sizes such as TO5, TO9, TO18, TO38, TO39, TO46, TO56, TO60 and TO65.Additionally, our R&D team can collaborate with clients to develop customized solutions.
 

TO Test Parameters:

Hermeticity

Leak rate is ≤1×10-3 Pa·cm 3/s

Insulation Resistance

 ≥1× 1010 Ω (500V DC) glass

Bending Resistance Test

Leads are bent to 90°, 3mm from substrate

Tensile Strength Test

1.5Kg weight is connected to lead for 30 seconds

Solderability Test

 Lead-free tin heated to 245 ℃±5 ℃ with KS-C-5W flux; immersion time 3 seconds

Pure Water Test

Immersion in deionized water at 25℃±5℃ for 24 hours
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WHO WE ARE

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  • With 23 years of experience in producing hermetic packages, Jitai ranks among China's most established manufacturers in the industry.
  • We have three fully-staffed R&D teams available for independent or collaborative work on large-scale projects.
  • We frequently invite domestic experts from leading universities like Tsinghua to train our R&D team on emerging technological trends.
  • ISO9001 certified
  • Meets military specifications
  • We have 11,000 square meters of state-of-the-art facilities completed.
We possess mass production capabilities and maintain consistent partnerships with over 30 machining suppliers.
● 6 chain-conveyer furnaces     ● 2 manual plating lines
● 4 diffusion furnaces      ● 1 automatic plating line
TECHNICAL-ADVANTAGES
 
TECHNICAL ADVANTAGES
●  With roots as a plating facility over 30 years ago, Jitai has honed proprietary techniques for unparalleled precision.
●  Proud recipients of 38 domestic technological patents, showcasing our commitment to innovation and excellence.
IN-2020-TOTAL-OUTPUT-VALUE-EXCEEDED-100-MILLION-RMB
 
PRICE ADVANTAGES
●  Leveraging decades of industry experience, we've optimized production with standardized quality assurance at every stage, 
efficient yield-boosting solutions, 
and meticulous cost control methodologies.
AWARDED-MORE-THAN-20-NATIONAL-PATENTS
 
PRODUCT ADVANTAGES
●  Benefit from our dedicated technical division and reliable customer service team.
●  We accommodate diverse materials, dimensions, and scales, tailoring packages to user or our own specifications.Collaborate with our engineers from R&D inception, ensuring functional, workable, and cost-effective product designs.

APPLICATIONS

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Our products are utilized in a wide range of industries, like medical, automotive, industrial lasers, telecommunications, sensors, home appliances, and more.
  • automobile

    Automobile
  • Optical-Communication

    Optical Communication
  • Industrial-Lasers

    Industrial Lasers
  • sensors

    Sensors
  • medical-treatment

    Medical Equipment
  • Home-Appliances

    Home Appliances
FOUNDED-IN-1998
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FOUNDED IN
PATENTS
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PATENTS
EMPLOYEES
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EMPLOYEES
MILLION-RMB-ANNUAL-OUTPUT
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MILLION RMB ANNUAL OUTPUT
PRODUCTS
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PRODUCTS

NEWS

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Comparing Metal Ceramic Packages with Hermetic Glass-to-Metal Seals: Cost and ROI

In electronic and optoelectronic packaging, two solutions often stand out for high-reliability environments: metal ceramic packages and hermetic glass-to-metal seals. While both approaches deliver the critical function of protecting sensitive devices from moisture, contaminants, and harsh operating

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The Role of Opto-Electronic Packaging in the Photonics Supply Chain

Photonics is reshaping industries from telecommunications to healthcare, and at the center of this transformation lies a less visible yet absolutely critical discipline: opto-electronic packaging. While photonic chips and devices grab the headlines, packaging is the bridge that makes them usable, re

2025-09-08
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Hermetic Packages vs. Non-Hermetic Packages:Cost, ROI, and Risk Analysis

Technologies for packaging are essential in a variety of sectors, including electronics, aerospace, pharmaceuticals, and food. Among the key considerations in packaging selection are whether to use hermetic packages—airtight enclosures that fully seal the contents—or non-hermetic packages, which off

2025-09-05
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Comparing Hermetic Packaging Materials: Ceramic, Metal, and Glass Options

When designing devices or products that require complete isolation from environmental factors—especially moisture, gas, or contaminants—hermetic packaging is essential. Achieving a hermetic seal ensures reliability, longevity, and protection of sensitive internal components, whether they are electro

2025-09-05

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   Whatsapp:+86 18916250130
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