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PRODUCTS

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We specialize in the development and manufacturing of diverse metal packaging and electronic components.
Opto-Electronic Packages
Opto-Electronic Packages
At Jitai, we aim to uphold structural integrity in demanding conditions while minimizing optical insertion loss in opto-electronic packages. Our range includes various shapes and sizes, each featuring multiple opto-channel design choices. We employ a range of forming and fabrication techniques tailored to specific production requirements.
 

Technical Parameters:

Hermeticity

≤  1 x 10-3  Pa * cm3 /s

Insulation Resistance

 ≥1× 1010 Ω (500V DC) glass

 ≥1× 109 Ω (500V DC) ceramic

Salt Spray Test

24h

Flatness

≤ 0.05mm

Roughness

0.8μm

Plating Quality Test

N2 450±10°C, 15 min

Temperature Cycling

-55°C to 125°C, 20 cycles

Thermal Shock

-55°C to 125°C, 20 cycles

Mechanical Shock

Condition B, Y1 Direction, 10,000g
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Power Packages
Power Packages
Power packages are ideal for projects requiring effective thermal dissipation. Usually, Jitai utilizes computer numerical control milling (CNC milling) for machining the center of the housing. Nevertheless, our diverse range of tooling options empowers us to craft a broad array of customized packages tailored to meet the specific requirements of virtually any project.
 

Technical Parameters:

Hermeticity

≤  1 x 10-3  Pa * cm3 /s

Insulation Resistance

 ≥1× 1010 Ω (500V DC) glass

 ≥1× 109 Ω (500V DC) ceramic

Salt Spray Test

24h

Flatness

≤ 0.05mm

Roughness

0.8μm

Plating Quality Test

N2 450±10°C, 15 min

Temperature Cycling

-55°C to 125°C, 20 cycles

Thermal Shock

-55°C to 125°C, 20 cycles

Mechanical Shock

Condition B, Y1 Direction, 10,000g
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Microwave Packages
Microwave Packages
●Structural options: There are many types of radio frequency housings, although their structures are usually flat. 
●Housing options: Housings are divided into two types; single body and split brazing. The single body type is formed by a machined center, with flexible design options. For split brazing, we process the housing and the base separately before they are brazed. 
●Base: The base must be manufactured with materials that dissipate heat well such as tungsten copper.
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HIC Packages
HIC Packages
With almost twenty-five years of expertise in manufacturing hermetic packages, Jitai stands as a leader in the industry. Given the critical role of hermetic packages in safeguarding delicate electronics, Jitai prioritizes stringent quality control measures. Our refined multi-step process ensures that every component undergoes rigorous quality and performance tests. Approved products are meticulously vacuum-packed with deoxidizing desiccant inserts and further shielded with protective packaging, ensuring that each Jitai product maintains its high quality from our factory to your doorstep.
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Nonconventional / Special Materials
Nonconventional / Special Materials
With nearly twenty-five years of expertise in manufacturing hermetic packages, Jitai stands out as a frontrunner in the industry. Given the critical role of hermetic packages in safeguarding delicate electronics, Jitai prioritizes stringent quality control measures. Our refined multi-step process ensures that every component undergoes rigorous quality and performance tests. Once approved, products are meticulously vacuum-packed with deoxidizing desiccant inserts and further shielded with additional protective packaging before shipment, ensuring that each Jitai product maintains its high quality from our factory to your hands.
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Circular Packages
Circular Packages
With almost 25 years of expertise in manufacturing hermetic packages, Jitai stands out as a leader in the industry. Our quality control ensures every component is rigorously tested to meet the highest standards. From individual vacuum-packing to additional protective packaging, we guarantee that every Jitai product maintains its top-notch quality from the factory to your hands.
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Sensor Packages
Sensor Packages
●Hermeticity: Must adhere to an airtightness requirement of ≤1×10-3Pa·cm3/s, as confirmed during fluctuating high-pressure testing.
●Insulation: Lead-to-housing insulation resistance must be ≥1×109Ω.
●Bonding: Inner wire bonding.
●Solderability: Shell surface should exhibit properties conducive to easy solderability.



 
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TO Packages
TO Packages
Transistor Outline (TO) packages consist of two parts: the TO header and the TO cap. We offer various standard TO connector shapes and sizes such as TO5, TO9, TO18, TO38, TO39, TO46, TO56, TO60 and TO65.Additionally, our R&D team can collaborate with clients to develop customized solutions.
 

TO Test Parameters:

Hermeticity

Leak rate is ≤1×10-3 Pa·cm 3/s

Insulation Resistance

 ≥1× 1010 Ω (500V DC) glass

Bending Resistance Test

Leads are bent to 90°, 3mm from substrate

Tensile Strength Test

1.5Kg weight is connected to lead for 30 seconds

Solderability Test

 Lead-free tin heated to 245 ℃±5 ℃ with KS-C-5W flux; immersion time 3 seconds

Pure Water Test

Immersion in deionized water at 25℃±5℃ for 24 hours
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WHO WE ARE

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  • With 23 years of experience in producing hermetic packages, Jitai ranks among China's most established manufacturers in the industry.
  • We have three fully-staffed R&D teams available for independent or collaborative work on large-scale projects.
  • We frequently invite domestic experts from leading universities like Tsinghua to train our R&D team on emerging technological trends.
  • ISO9001 certified
  • Meets military specifications
  • We have 11,000 square meters of state-of-the-art facilities completed.
We possess mass production capabilities and maintain consistent partnerships with over 30 machining suppliers.
● 6 chain-conveyer furnaces     ● 2 manual plating lines
● 4 diffusion furnaces      ● 1 automatic plating line
TECHNICAL-ADVANTAGES
 
TECHNICAL ADVANTAGES
●  With roots as a plating facility over 30 years ago, Jitai has honed proprietary techniques for unparalleled precision.
●  Proud recipients of 38 domestic technological patents, showcasing our commitment to innovation and excellence.
IN-2020-TOTAL-OUTPUT-VALUE-EXCEEDED-100-MILLION-RMB
 
PRICE ADVANTAGES
●  Leveraging decades of industry experience, we've optimized production with standardized quality assurance at every stage, 
efficient yield-boosting solutions, 
and meticulous cost control methodologies.
AWARDED-MORE-THAN-20-NATIONAL-PATENTS
 
PRODUCT ADVANTAGES
●  Benefit from our dedicated technical division and reliable customer service team.
●  We accommodate diverse materials, dimensions, and scales, tailoring packages to user or our own specifications.Collaborate with our engineers from R&D inception, ensuring functional, workable, and cost-effective product designs.

APPLICATIONS

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Our products are utilized in a wide range of industries, like medical, automotive, industrial lasers, telecommunications, sensors, home appliances, and more.
  • automobile

    Automobile
  • Optical-Communication

    Optical Communication
  • Industrial-Lasers

    Industrial Lasers
  • sensors

    Sensors
  • medical-treatment

    Medical Equipment
  • Home-Appliances

    Home Appliances
FOUNDED-IN-1998
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FOUNDED IN
PATENTS
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PATENTS
EMPLOYEES
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EMPLOYEES
MILLION-RMB-ANNUAL-OUTPUT
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MILLION RMB ANNUAL OUTPUT
PRODUCTS
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PRODUCTS

NEWS

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