The composition and content of gases in sealed electronic devices and components in electronic systems can have a significant impact on the performance, life and reliability of the devices themselves. They can easily lead to serious consequences such as reduced performance and life of electronic device components. Among them, device failure caused by hydrogen results from: (1) accelerating the corrosion of electronic devices; (2) causing oxidation, short circuiting, and the burn failure of electronic components; (3) hydrogen poisoning of GaAs chips, seriously degrading the functionality of chips and devices. Therefore, for metal packaging, control of the internal hydrogen content is a crucial issue.

The main sources of hydrogen content inside the metal housing are as follows: (1) The metal housing material itself introduces hydrogen during the manufacturing process; (2) Processes such as annealing, sintering, and welding may be carried out in a hydrogen atmosphere to introduce hydrogen; (3) The electroplating process of the metal housing will also introduce hydrogen. These processes of introducing hydrogen cannot be completely avoided. With the packaging and use of the metal housing, the hydrogen in the housing will be released slowly. Since the hermetic seal stops hydrogen from escaping outside the device, hydrogen accumulates inside the sealed cavity, which can easily cause device function failure. As such, certain measures should be taken to reduce the hydrogen content inside the metal housing. A common method at present is to bake the electroplated metal housing for a longer period of time within a nitrogen atmosphere, so as to eliminate the hydrogen adsorbed in the packaging material.

In order to meet customers’ demands for product dehydrogenation, our company is equipped with a High-Temp Vacuum Oven, which can meet the requirements of product dehydrogenation.  This effectively guarantees the performance of the product and while also vastly improving its reliability.

Post time: Nov-16-2022