Main products include metal package for hybrid integrated circuits, opto-electronic components, microwave components, wave filter components, sensor components and high-power devices. The products are applicable in such areas as aviation, aerospace, electronics and communication devices for military and commerciality. Company has undertaken the ministerial level scientific research projects, and recognized by users.
There are various kinds of opto-electronic packages,the structure is various with opto channel design.The manufacture of package should choose different forming and fabricating method.This series paackage is suitable for opto-electronic device assembly.
*Various kinds of structure for package,with structure of fiber tube or window cap.
*Different kinds of materials for packages, it should be chosen by characterisitcs of package.
*There are leads of rectangular cross section or round cross section.
*The leads lead out from the bottom or sidewall and its ranking formations could per design of customers’ needs.
*Cap sealing or lid sealing is chosen by proper technologies per the structure of packages.
*Customer choose package fully plating Au or leads selective plating Au per their needs.
The metal package of opto-electronic device should stand、protect the chip of opto-electronic device and play a role in transmitting opto signals,making a significant role in protecting opto parameters and the reliability of device.With the usage range for opto-electronic device wider and wider,it requires quality higher and higher.It adopts hermetic sealing formation increasing the longer period of reliability for devices.
Our company has a set of mature production technique there are main displayment in the following:
①The selection of material:there is internal stress after inner device solder the package fixed,to lower the internal stress the material of 4J29 should be choosen by nearly CTE it is suitable for matched sealing which requires the materials having similar CTE.Result in that the material of leads should choose 4J29.The materials of glass insulators should be choosen Japanese BH power having a similarity to 4J29 in CTE.
②The oxidation technique,key technique in sintering procedure.Our oxidation technique is letting in some nitrogen in the oxidation stove whose quantity should be controlled under flowmeter.It keeps status of oxidation in certain temperature and finally forms mouse color grey compact oxidation layer.The main composition is Fe2O4 and FeO after analysis of X-ray layer diffractormeter.The oxide meets the requirement for good glass-to-metal sealing referred by document literature.
③Sintering procedure include temperature curve of sintering,environment,and time of sintering,cooling off and etc parameters.The temperature of sintering should not be too high to largely increase gas quantity dissolved in glass liquid.Too much gas turns bubbles due to not volatilization.It severly affects sealing strength and insulation resistance and with lower level it couldnot immerse lasss and metal the thickness of transition is too thin and lower sealing strength.With too rapid temperature cooling the surface of glass insulator cools quickly so that too much bubble could not volatize in time as well as inner bubbles rise.Additionally the humidity of sintering stove is too large,vapors partly dissolve in glass liquid in high temperature and rise bubbles after coolling down.So that three technique conditions in furnace during sintering procedure are environment、temperature、time which play an important role in sealing quality.Based on document lliterature the sintering environment is better for neutral or weak reducibility.
④The electroplating technique,the coating of surface is key for appearance of product、bonding requirement and weldability.Our company uses wholly underplating electrolytic Ni and fully plating Au and the appearance and bonding of pin should meet the requirement.
There are advantages for opto-electronic package made by our current technique :
①Seen from appearance the fillin of glass insulator is even and no climb,no dent,no bubble and so on defects.
②Seen from performance,the insulation resistance is high.
③Adhension of coating is strong
④Bonding strength is high
⑤The stress of Ni plating is small and the strength of anti lead fatigue is big.
⑥The resistance of high temperature,oxidation,corresion and aging for package is super strong.
⑦The product has reliable hermeticity.