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  • Factory directly supply Precision Hermetic Technology - Flat Metal Package – Jitai

    Factory directly supply Precision Hermetic Technology - Flat Metal Package – Jitai

    Main products include metal package for hybrid integrated circuits, opto-electronic components, microwave components, wave filter components, sensor components and high-power devices. The products are applicable in such areas as aviation, aerospace, electronics and communication devices for military and commerciality. Company has undertaken the ministerial level scientific research projects, and recognized by users. Flat metal package is divided into one-piece or multi-piece brazing type...
  • Factory For Hermetic Seal Technology - Metal Package Parts – Jitai

    Factory For Hermetic Seal Technology - Metal Package Parts – Jitai

    Main products include metal package for hybrid integrated circuits, opto-electronic components, microwave components, wave filter components, sensor components and high-power devices. The products are applicable in such areas as aviation, aerospace, electronics and communication devices for military and commerciality. Company has undertaken the ministerial level scientific research projects, and recognized by users. Part One: The categories of metal package materials Our company are able...
  • High definition Stainless Steel Header - The Platform Package – Jitai

    High definition Stainless Steel Header - The Platform Package – Jitai

    Main products include metal package for hybrid integrated circuits, opto-electronic components, microwave components, wave filter components, sensor components and high-power devices. The products are applicable in such areas as aviation, aerospace, electronics and communication devices for military and commerciality. Company has undertaken the ministerial level scientific research projects, and recognized by users. Packages are made up by mechanically pressing for platform packages,it h...
  • OEM manufacturer Semiconductor Package Types - Process of Lid – Jitai

    OEM manufacturer Semiconductor Package Types - Process of Lid – Jitai

    Main products include metal package for hybrid integrated circuits, opto-electronic components, microwave components, wave filter components, sensor components and high-power devices. The products are applicable in such areas as aviation, aerospace, electronics and communication devices for military and commerciality. Company has undertaken the ministerial level scientific research projects, and recognized by users. Part One:Introduction Of Lid Material The materials of lid usually are 4...
  • Chinese wholesale Hermetic Optical Package - Electronic Connector Components – Jitai

    Chinese wholesale Hermetic Optical Package - Electronic Connector Components – Jitai

    Main products include metal package for hybrid integrated circuits, opto-electronic components, microwave components, wave filter components, sensor components and high-power devices. The products are applicable in such areas as aviation, aerospace, electronics and communication devices for military and commerciality. Company has undertaken the ministerial level scientific research projects, and recognized by users. Electrical connector components are one of necessary electronic componen...
  • Professional China Controlled Expansion Alloy Package - Pressure Sensor Package – Jitai

    Professional China Controlled Expansion Alloy Package - Pressure Sensor Package – Jitai

    Main products include metal package for hybrid integrated circuits, opto-electronic components, microwave components, wave filter components, sensor components and high-power devices. The products are applicable in such areas as aviation, aerospace, electronics and communication devices for military and commerciality. Company has undertaken the ministerial level scientific research projects, and recognized by users. Pressure Sensor Package adopts compression sealing.It should withstand high ...
  • Low MOQ for Hermetic Hybrid Package - Process of Lid – Jitai

    Low MOQ for Hermetic Hybrid Package - Process of Lid – Jitai

    Main products include metal package for hybrid integrated circuits, opto-electronic components, microwave components, wave filter components, sensor components and high-power devices. The products are applicable in such areas as aviation, aerospace, electronics and communication devices for military and commerciality. Company has undertaken the ministerial level scientific research projects, and recognized by users. Part One:Introduction Of Lid Material The materials of lid usually are 4...
  • Competitive Price for Electronic Component Packages - Plug-In Sidewall Package – Jitai

    Competitive Price for Electronic Component Packages - Plug-In Sidewall Package – Jitai

    Main products include metal package for hybrid integrated circuits, opto-electronic components, microwave components, wave filter components, sensor components and high-power devices. The products are applicable in such areas as aviation, aerospace, electronics and communication devices for military and commerciality. Company has undertaken the ministerial level scientific research projects, and recognized by users. Selection of material Plug-In sidewall package adopts two method of...
  • PriceList for Spcc Package - Plug-In Sidewall Package – Jitai

    PriceList for Spcc Package - Plug-In Sidewall Package – Jitai

    Main products include metal package for hybrid integrated circuits, opto-electronic components, microwave components, wave filter components, sensor components and high-power devices. The products are applicable in such areas as aviation, aerospace, electronics and communication devices for military and commerciality. Company has undertaken the ministerial level scientific research projects, and recognized by users. Selection of material Plug-In sidewall package adopts two method of...
  • 2018 High quality Electronic Package Material - Process of Lid – Jitai

    2018 High quality Electronic Package Material - Process of Lid – Jitai

    Main products include metal package for hybrid integrated circuits, opto-electronic components, microwave components, wave filter components, sensor components and high-power devices. The products are applicable in such areas as aviation, aerospace, electronics and communication devices for military and commerciality. Company has undertaken the ministerial level scientific research projects, and recognized by users. Part One:Introduction Of Lid Material The materials of lid usually are 4...
  • China Manufacturer for Gold Plate Hybrid Package - Flat Metal Package – Jitai

    China Manufacturer for Gold Plate Hybrid Package - Flat Metal Package – Jitai

    Main products include metal package for hybrid integrated circuits, opto-electronic components, microwave components, wave filter components, sensor components and high-power devices. The products are applicable in such areas as aviation, aerospace, electronics and communication devices for military and commerciality. Company has undertaken the ministerial level scientific research projects, and recognized by users. Flat metal package is divided into one-piece or multi-piece brazing type...
  • 2018 wholesale price Hermetic Fiber Optic Packages - Process of Lid – Jitai

    2018 wholesale price Hermetic Fiber Optic Packages - Process of Lid – Jitai

    Main products include metal package for hybrid integrated circuits, opto-electronic components, microwave components, wave filter components, sensor components and high-power devices. The products are applicable in such areas as aviation, aerospace, electronics and communication devices for military and commerciality. Company has undertaken the ministerial level scientific research projects, and recognized by users. Part One:Introduction Of Lid Material The materials of lid usually are 4...
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